Bestry provides customers with the underfill material with excellent performance to effectively fill gaps among CSP, BGA, WLCSP, LGA and PCB. It can be cured rapidly, provide excellent protection for solder joints, and improve the reliability of products in the thermal cycle, thermal shock, drop impact test and actual use.

• Low viscosity, leading to the fast flow at the room temperature.

• High reliability: Impact and drop resistance, high temperature and humidity resistance, and temperature cycle resistance.

• Excellent surface insulation resistance (SIR).

• Excellent flux compatibility.

• Balanced reliability and repairability.

• Environmentally friendly materials in compliance with ROHS and HF.

Bestry has developed advanced board-level encapsulation materials to protect chips, solder joints, leads and pins from environmental influences, and improve mechanical performance and reliability.

Good Production Process Performance

• Excellent dispensing and jetting performance.

• Achieve the precise shape control and narrow filletwith the thixotropic feature.

• Perform a detection outside the UV light Online UV Inspection.

Rapid Curing and Multiple Curing Methods

• Heat curing, UV curing + heat curing, UV curing + moisture curing can be used to adhere a variety of substrates during the efficient production, and further improve the resistance to cold and heat cycles, impact and drop.

Excellent Electrical Performance, Heat and Humidity Resistance

• Under 85 ℃, 85% RH, high temperature and high humidity, the excellent surface insulation resistance can be remained.

• Able to withstand harsh environments.

• Compatible with the lead-free reflow soldering process.

The SMT process of PCB is subject to the high-performance device fixing materials. Bestry's red adhesive product not only solves the low-temperature curing requirement of heat-sensitive components, but also is applicable to the high-temperature lead-free wave soldering with the unique low-temperature curing technology.

• High thixotropy, which can precisely control the shape and size of the glue line.

• Rapid curing at the low temperature.

• Excellent heat resistance.

• Excellent electrical characteristics and high stability.

Large-screen, ultra-narrow-edge, and full-screen designs have gradually become the future direction of consumer electronic products, which poses greater challenge to the reliability of equipment.

Bestry provides PUR materials with the excellent performance for the full screen display, which are suitable for plastic, metal, glass and other substrates. Additionally, the PUR materials are featured with the excellent bonding strength, impact resistance, chemical corrosion resistance, thermal shock resistance, and high temperature and humidity resistance, which can accomplish the high-reliable assembling of touch screens with cases of mobile phones, tablet computers, and wearable devices.

• Long operating time.

• Precise jet dispensing.

• Rapid curing.

• Compatible with PC, PA, PBT, metal and many other substrates with the excellent bonding performance.

• Excellent impact resistance.

• Excellent high temperature and humidity resistance.

• Excellent chemical resistance, hand sweat resistance, and organic solvent resistance.

• Housing bonding.

• VCM assembly.

• Active alignment process.

• Lens barrel bonding and fixing.

• Chip bonding.

• Lead encapsulation.

• IR glass bonding.

• Flexible circuit board reinforcement.

Bestry has developed the industry-leading thermal curing material to bond camera components:

• Rapid curing at the low temperature.

• Low bleeding and controllable fluidity.

• High adhesion to various substrates (including glass, metal and commonly used low-temperature stable plastics, such as PC, LCP, PA, PBT, ABS, PPA and FR4 with various solder resistant coatings).

• High reliability and heat resistance.

Temperature is a key factor to affect the performance of electronic device. With the miniaturization of electronic equipment, the stable operation of the equipment is subject to the efficient heat dissipation. Bestry’s heat curing and thermal conductive materials cured at the room temperature can be applied to the connection of transformers, transistors and other heating electronic components, as well as printed circuit board components or radiators to provide the excellent thermal conductivity.

• Efficient heat conduction.

• Adhesion replaces mechanical fastening to achieve the lightweight and miniaturized product design.

• High reliability.

• Easy to be processed and low overall cost.