Epoxy Resin

Bestry epoxy for structural bonding can provide the ideal bonding strength, long-term reliability and low odor, and can meet the requirement in different circumstances.

Bestry Materials can provide all kinds of epoxy structural adhesives to meet the demands of customers in their design and manufacture, including aeronautics and astronautics, kitchen appliances and sports equipment, automotive electronics and consumer electronic.

One-Component Low-Temperature Cured Epoxy Material

In the consumer electronic markets, smaller, lighter, thinner and faster consumer electronic equipment are the trend of future products designs. How to make smaller and lighter consumer devices with more powerful processing capability is the major challenge we face, in consequence, non-traditional metal, glass, plastics have been widely used, which requires low operating temperature and high curing efficiency during the assembling. To ensure efficiency in mass-production, the materials with long curing time or short service life cannot meet the requirements, so the one-component low-temperature cured epoxy becomes the optimal option.

In this case, the one-component low-temperature cured epoxy material becomes one of the optimal solution. Bestry adhesives can meet the current and future requirements in bonding in the consumer electronic, including the FPC / PCB with various surface properties and liquid crystal polymer (LCP) with different specifications, provide support for customers, and assist them in addressing bonding problems encountered in practical applications.

单组分低温固化环氧材料

Product	Features	Color	Viscosity (cps @ 25℃)	TI	Tg(℃)	Curing conditions	Pot life at 25℃ (days)
P-TE2110	General type featured with good adhesion to a variety of substrates	Black	21000	6	55	30min @ 80℃	3
P-TE2110L	Low viscosity version PTE2	Black	8000	4.3	51	30min @ 80℃	3
P-TE2110LT	Rapid curing at the low temperature	Black	20000	6	54	30min @ 60℃	2
P-TE2111	Low bleeding and rapid curing	Black	24000	5.5	46	30min @ 80℃	3
P-TE2112	Excellent adhesion to LCP, PA and other materials with the low surface energy	Black	19500	4.9	45	30min @ 80℃	3
P-TE2113	Excellent adhesion to PC materials	Black	25000	4.9	44	30min @ 80℃	3
P-TE2115	Heat resistance and high Tg	Black	19000	5	94	60min @ 85℃	3
P-TE2116	Excellent impact resistance and low hardness	Black	25000	3.1	30	30min @ 80℃	3
P-TE2119	Excellent adhesion to metal materials	Black	1150	4.7	43	30min @ 85℃	3

With the Bestry's unique low-temperature thermal curing epoxy technology, the balance can be achieved between the rapid low-temperature curing and storage stability.

For more information, please consult our local sales engineers.

One-Component Medium and High Temperature Curing Epoxy Material

Bestry's high-performance, medium and high-temperature curing adhesive material can meet the current and future requirements on bonding in the industry, auto-motives and consumer electronic. It can be widely applied to aircraft and automobile manufacturing, bicycles, ships, golf clubs, skiing, FR4 board-level packaging, potting and other applications. It can be applied to almost all scenarios as required.

Additionally, it can be applied to scenarios where the high-strength bonding and resistance to the critical environment are required. This type of epoxy resins with different formulas can be designed with plastic elasticity, metal rigidity, or transparency or opacity of the resin. After formulation developments, this type of adhesives are featured with multiple functions, which can meet almost all requirements on bonding metal, glass, stone, carbon fibers, FR4 and other materials.It can solve the difficult problems of bonding which the customers encountered in practical applications perfectly.

• One component, long shelf life at -20°C or lower temperature.

• High adhesion to various substrates (including glass, metal, FR4, and carbon fiber).

• High reliability and heat resistance (some products can stand up to 220 ℃ or above).

• Low stress, high elogation, impact resistance and high fatigue resistance to withstand harsh conditions.

• Easy to be applied to liquid, paste or film solutions.

• Controllable rheology.

单组份中高温固化环氧材料

Product	Features	Color	Viscosity (cps @ 25℃)	Tg (℃)	Curing conditions	Storage temperature (℃)
P-TE2020	It can flow rapidly at the room temperature, be easy re-work, underfill for BGA and CSP	Black	350~450	102	8min @ 130℃	-40℃
P-TE2021	Excellent SIR performance, underfill for BGA and CSP	Black	400~500	109	8min @ 150℃	-40℃
P-TE2030	High reliability, -unreworkabl,and WLCSP underfill	Black	4500~5500	130	8min @ 150℃	-40℃
P-TE2011	Flexible, low Tg, low modulus, and suitable for local PCB protection	Black	9000-11000	5	8min @ 130℃	-40℃
P-TE2050	Featured with the high Tg and high reliability, and served as thermalconductive potting materials for automotives and outdoor equipment.	Black	50000	140	2h @ 140℃	-40℃
P-TE2051	Rapidly cured at the medium temperature, and served as the potting material of transistors and semiconductor devices	Black	54000	138	15min @ 150℃	-40℃
P-TE2012	Excellent SIR performance, low bleeding, and tiny gap bonding and sealing	Black	23000	96	20min @ 150℃	-40℃
P-TE2301	High Tg, and high adhesion to metal, glass, FR4 and other materials	Black	7000	122	30min @ 150℃	-40℃
P-TE2303	Electrical and thermal conductivity, low shrinkage, low bleeding from the Au material, and chip fixation	Silver	8000	-46	30min @ 175℃	-40℃

For more products, please consult our local sales engineers.

Cationic Epoxy Material

Compared with other curing systems, the cationic curable epoxy material has the low shrinkage rate and no oxygen inhibition, and is free of nucleophilic impurities. Once initiated, the polymerization will proceed continuously. Based on these features, Bestry has developed a series of cationic epoxy adhesives with the UV light-delayed curing. Meanwhile, upon the application requirements, we can provide dual-curing system products, UV light curing and thermal curing. It can be widely applied in 3D printing, optics, and camera modules assembly.

阳离子环氧材料

Product	Curing method	Features	Color	Viscosity(cps @ 25℃)	Ti	Tg(℃)	Curing conditions	Storage temperature (℃)
A-DE2501	UV / heating	Low-energy curing, low shrinkage, and low CTE	Milk white	32000	5.1	176	LED 365nm ≥ 600mj / cm² 50min @ 80℃ / 25min @ 100℃	-20℃
P-DE2502	UV / heating	Low viscosity, low shrinkage, and low CTE	Transparent	3000	2	155	LED 365nm ≥ 1000mj / cm² 60min @ 80℃ / 30min @ 100℃	-20℃
P-DE2503	UV / heating	High viscosity, thixotropy, low shrinkage, and low CTE.	Black	125000	5.7	145	LED 365nm ≥ 1200mj / cm² 50min @ 80℃ / 25min @ 100℃	-20℃
O-DE2608	UV / heating	High viscosity, thixotropy, low shrinkage, and CTE of less than 10 pmmppm / ℃	Grey	100000	4.5	160	LED 365nm ≥ 3000mj / cm² 50min @ 80℃ / 25min @ 100℃	-20℃
D-DE2100	UV	Low viscosity, low shrinkage, and fast curing	Transparent	300	-	135	LED 365 nm ≥ 1000 mj / cm²	RT
D-DE2200	UV	Low viscosity, low shrinkage, and fast curing.	Transparent	1000	-	122	LED 365nm ≥ 1000mj / cm²	RT

For more products, please consult our local sales engineers.

Two-Component Epoxy Material

Bestry’s two-component epoxy adhesive is featured with the unique flexibility in the curing speed and performance. This material is designed to be applied to the scenarios with the performance requirements, such as the adjustable curing time, low shrinkage, high thermal conductivity, abrasion resistance, high bonding strength, high temperature resistance, and mechanical shock resistance. It has distinctive performance features, and can be widely applied to mechanical, thermal, optical, electronic and electrical fields.

• The active period and curing velocity can be flexibly adjusted according to the application.

• Impact resistance and high fatigue resistance.

• When it is used under important scenarios, it is featured with the high peeling and shear strength, and strong adhesion.

• Two component solutions can be cured at room temperature, making it an easy-to-use solution in high-loss applications.

• Strong adhesion to metals and thermosetting composite materials.

双组分环氧材料

Product	Color	Operational time @ 23℃ min	min Fixture time / min	Mixing ratio (volume ratio)	Viscosity (cp)	Modulus of elasticity (Mpa)	Aluminum bonding strength (Mpa)	Features
P-TE2601	Yellow	1.5	5	100 : 25	25	1000	22	Fast curing and multi-purpose
P-TE2602	Yellow	6	20	100 : 100	30	2500	18	Fast curing and multi-purpose
P-TE2603	Grey	6	60	100 : 100	Thixotropy	5500	20	Low shrinkage
P-TE2604	Yellow	10	30	100 : 100	80	2300	18	Toughened and good chemical resistance
P-TE2605	Dark gray	40	270	100 : 50	25	5500	16	Chemical resistance
P-TE2606	Grey	40	240	100 : 100	Thixotropy	4700	14	High temperature resistance, weathering resistance and chemical resistance

For more products, please consult our local sales engineers.